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Giải thích chi tiết về linh kiện  3.3V Uniform Sector Dual and Quad Serial Flash
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3.3V Uniform Sector
Dual and Quad Serial Flash
GD25S512MD
7
Serial MCP Device Configuration
Figure 2 GD25S512MD Device configuration
Die 1#
Die 0#
GD25B256D
GD25S512MD
GD25B256D
CS#
SCLK
RESET#
(1)
IO0
IO1
IO2
IO3
Note: 1. RESET# pin is available on SOP16 and TFBGA packages
All signal pins are shared by the stacked dies
within the package. Each die is assigned a “Die ID#” in the factory. Only
a single die is active at any given time, and have the control of SPI bus to communicate with the external SPI controller.
However, all the dies will accept two instructions regardle
ss their Active or Idle status: a) “Software Die Select (C2H)”
instruction: it is used to set any single die to be active according to the 8-
bit Die ID following the instruction. b) “Software
Reset (66H+99H)” instruction: it is used to reset all the stacked dies to the power-up state.



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