LTC3370 datasheet(42/44 Pages) LINER

tên linh kiện	LTC3370

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PDF	44 Pages

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LTC3372

Rev. A

For more information www.analog.com

PACKAGE DESCRIPTION

7.00 ±0.10

(4 SIDES)

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 TOP MARK

(SEE NOTE 6)

PIN 1

CHAMFER

C = 0.35

0.40 ±0.10

BOTTOM VIEW—EXPOSED PAD

5.50 REF

(4-SIDES)

0.75 ±0.05

R = 0.115

TYP

0.25 ±0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UK48) QFN 0406 REV C

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

5.50 REF

(4 SIDES) 6.10 ±0.05 7.50 ±0.05

0.25 ±0.05

0.50 BSC

PACKAGE OUTLINE

5.15 ±0.10

5.15 ±0.05

R = 0.10

TYP

UK Package

48-Lead Plastic QFN (7mm

× 7mm)

(Reference LTC DWG # 05-08-1704 Rev C)

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