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XIO2000AI bảng dữ liệu(PDF) 142 Page - Texas Instruments

tên linh kiện XIO2000AI
Giải thích chi tiết về linh kiện  PCI Express to PCI Bus Translation Bridge
PDF  160 Pages
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XIO2000AI bảng dữ liệu(HTML) 142 Page - Texas Instruments

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Electrical Characteristics
133
April 2007 Revised October 2008
SCPS155C
7
Electrical Characteristics
7.1
Absolute Maximum Ratings Over Operating Temperature Ranges
Supply voltage range:
VDD_33
–0.5 V to 3.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VDD_15
–0.5 V to 1.65 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCCP
–0.5 V to 5.25 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range,
VI: PCI
–0.5 V to VCCP + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VI: PCI Express (RX)
–0.6 V to 0.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VI: PCI Express REFCLK (single-ended)
–0.5 V toVDD_33 + 0.5 V
. . . . . . . . . . . .
VI: PCI Express REFCLK (differential)
–0.5 V toVDD_15 + 0.5 V
. . . . . . . . . . . . . .
VI: Miscellaneous 3.3-V IO
–0.5 V to VDD_33 + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range:
VO: PCI
–0.5 V to VDD_33 + 0.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VO: PCI Express (TX)
–0.5 V to VDD_15 + 0.5V
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
VO: Miscellaneous 3.3-V IO
–0.5 V to VDD_33 + 0.5 V
. . . . . . . . . . . . . . . . . . . . . .
Input clamp current, (VI < 0 or VI > VDD) (see Note 1)
±20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, (VO < 0 or VO > VDD) (see Note 2)
±20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Human body model (HBM) ESD performance
1500 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charged device model (CDM) ESD performance
500 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. Applies for external input and bidirectional buffers. VI < 0 or VI > VDD or VI > VCCP.
2. Applies to external output and bidirectional buffers. VO < 0 or VO > VDD or VO > VCCP.
7.2
Recommended Operation Conditions
OPERATION
MIN
NOM
MAX
UNITS
VDD_15
Supply voltage
1.35
1.5
1.65
V
VDDA_15
Supply voltage
1.5 V
1.35
1.5
1.65
V
VDD_33
VDDA_33
Supply voltage
3.3 V
3
3.3
3.6
V
VDDA_33_AUX
Supply voltage
3
3.3
3.6
V
VCCP
PCI bus clamping rail voltage
3.3 V
3
3.3
3.6
V
VCCP
PCI bus clamping rail voltage
5.0 V
4.75
5
5.25
V
TA
Operating ambient temperature range
XIO2000A
(Commercial)
0
25
70
_C
TA
Operating ambient temperature range
XIO2000AI
(Industrial)
–40
25
85
_C
TJ
Virtual junction temperature (Note 3)
0
25
115
_C
NOTE 3: The junction temperature reflects simulated conditions. The customer is responsible for verifying junction temperature.



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