AW33201/AW33205/AW33209

Jan 2018 V1.3

www.awinic.com.cn

15

Copyright © 2016 SHANGHAI AWINIC TECHNOLOGY CO., LTD

REFLOW

Figure 16 Package Reflow Oven Thermal Profile

Reflow Note

Spec

Average ramp-up rate (217°C to Peak)

Max. 3°C /sec

Time of Preheat temp.(from 150°C to 200°C)

60-120sec

Time to be maintained above 217°C

60-150sec

Peak Temperature

>260°C

Time within 5°C of actual peak temp

20-40 sec

Ramp-down rate

Max. 6°C /sec

Time from 25°C to peak temp

Max. 8min

NOTE 1: All data are compared with the package-top temperature, measured on the package surface;

NOTE 2: AW332XX adopted the Pb-Free assembly.