GPR23L3211E

© Generalplus Technology Inc.

Proprietary & Confidential

7

DEC. 25, 2009

Version: 1.2

7. APPLICATION NOTE

7.1. Power Pad Bonding Guideline

1. Except NC pads, all the other Power pads should be wire bonded, please do not keep them floating.

2. Please keep the PCB layout width

ε 20 mil for the VCC/VCCQ and VSS/VSSQ.(Figure 1)

3. For better noise immunity, it is recommended to add Bead (300mA minimum) and Bypass capacitor near to the VCC/VCCQ pins.

(Figure 2)

7.2. PCB Layout Suggestion

1. The Substrate should be floating, not connected to GROUND.

2. Each Power pad (VCC/VCCQ, VSS/VSSQ) should be wire bonded to a dedicated power pin, then keep one centimeter distance at least

before the user want to merge the PCB layout for those pins , can not be just bonded each Power pad to the same power pin.(Figure 3)

3. The Address and Data bus lines of MROM should be separated away in PCB layout.

4. Each Control pin (PCEB or POEB) should be shielded by GROUND lines.

5. If the Connector is adopted in the PCB, it is recommended to connect more sets of connections to VSS/VSSQ and VCC/VCCQ for both

the PCB and the system.

Figure 1 Power Pin Pitch

Figure 2 Bead and Bypass Capacitor to Power Pin

Figure 3 Dedicated Power Pin