High Speed CMOS Logic – 54HC244

Octal 3-State Non-Inverting Buffer / Line Driver / Line Receiver in bare die form

Rev 1.1

01/05/18

 

 

Output Drive Capability: 15 LSTTL Loads

Low Input Current: 1µA

Outputs directly interface CMOS, NMOS and TTL

Operating Voltage Range: 2V to 6V

CMOS High Noise Immunity

Function compatible with 54LS244

 

 

 

 

Full Military Temperature Range.

 

 

 

 

Features:

Ordering Information

The following part suffixes apply:

No suffix - MIL-STD-883 /2010B Visual Inspection

The 54HC244 is fabricated using a 2.5µm 5V CMOS

process and has the same high speed performance of

LSTTL combined with CMOS low power consumption. The

device can be used as two 4-bit buffers or one 8-bit buffer

and features non-inverting inputs with two output enables,

each controlling four of the 3-state outputs. The device is

specifically designed to improve performance and density in

clock drivers, 3-state memory address drivers and bus

orientated transmitters and receivers. Inputs include clamp

diodes that enable the use of current limiting resistors to

Description

Die Dimensions in µm (mils)

1900 (75)

 

 

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

 

 

 

 

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

 

 

Supply Formats:

Die Size (Unsawn)

1900 x 2050

75 x 81

µm

mils

 

100 x 100

 

 

 

Minimum Bond Pad Size

3.94 x 3.94

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Mechanical Specification

Default – Die in Waffle Pack (100 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

Page 1 of 6 

www.siliconsupplies.com