Advanced CMOS TTL Input – 54ACT14

Hex Schmitt-Trigger Inverter with LSTTL compatible inputs in bare die form

Rev 1.0

11/03/19

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Die Size (Unsawn)

1270 x 110

50 x 43

µm

mils

Minimum Bond Pad Size

70 x 70

2.76 x 2.76

µm

mils

Die Thickness

280 (±20)

11.02 (±0.79)

µm

mils

Top Metal Composition

Al-Si-Cu

Back Metal Composition

N/A – Bare Si

Schmitt Trigger Inputs

TTL & CMOS compatible Input Levels

Outputs Sink/Source 24mA

Outputs directly interface CMOS, NMOS and TTL

High noise immunity

Functionally compatible with bipolar 54F14

Full Military Temperature Range

Features:

Ordering Information

The following part suffixes apply:

No suffix - MIL-STD-883 /2010B Visual Inspection

Description

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Default – Die in Waffle Pack (400 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 280µm(11 Mils) – On request

Assembled into Ceramic Package – On request

The 54ACT14 Hex Schmitt-Trigger Inverter is fabricated

using an advanced CMOS process combining LSTTL

speed with CMOS low power consumption while

delivering high output drive. The device performs the

Boolean function Y = Ᾱ in positive logic. Device inputs

directly accept LSTTL or CMOS. Schmitt-Trigger inputs

transform slow input rise and fall times into sharply

defined jitter-free output signals. Due to the hysteresis

voltage of the Schmitt trigger, the 54ACT14 is useful in

noisy environments. All inputs are protected against

ESD and excess voltage transients.

Die Dimensions in µm (mils)

1270 (50)

Mechanical Specification

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