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CD4093B bảng dữ liệu(PDF) 3 Page - Silicon Supplies |
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CD4093B bảng dữ liệu(HTML) 3 Page - Silicon Supplies |
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3 / 6 page ![]() Page 3 of 6 www.siliconsupplies.com CMOS High Voltage Logic – CD4093B Rev 1.0 21/11/17 PARAMETER SYMBOL MIN MAX UNITS Supply Voltage VDD 3.0 18 V DC Input Voltage, Output Voltage VIN, VOUT 0 VDD V Operating Temperature Range TJ -55 +125 °C Recommended Operating Conditions3 (Voltages referenced to V SS) Absolute Maximum Ratings1 PARAMETER SYMBOL VALUE UNIT DC Supply Voltage (Referenced to VSS) VDD -0.5 to +20 V DC Input or Output Voltage (Referenced to VSS) VIN, VOUT -0.5 to VDD+0.5 V Storage Temperature Range TSTG -65 to 150 °C Input Current or Output Current (per Pad) IIN, IOUT ±10 mA Power Dissipation in Still Air 2 PD 500 mW LIMITS PARAMETER SYMBOL VDD CONDITIONS 25°C 85°C FULL RANGE 4 UNITS 5V VIN = VDD or VSS 4.95 4.95 4.95 10V VIN = VDD or VSS 9.95 9.95 9.95 Minimum High- Level Output Voltage VOH 15V VIN = VDD or VSS 14.95 14.95 14.95 V 5V VIN = VDD 0.05 0.05 0.05 10V VIN = VDD 0.05 0.05 0.05 V Maximum Low- Level Output Voltage VOL 15V VIN = VDD 0.05 0.05 0.05 Maximum Input Leakage Current IIN 18V VIN = VDD or VSS ±0.1 ±0.1 ±1.0 µA 5V 1 30 30 10V 2 60 60 15V 4 20 120 Maximum Quiescent Supply Leakage Current IDD 20V VIN = VDD or VSS IOUT = 0µA 20 60 600 µA 5V VIN = VDD or VSS VOL = 0.4V 0.64 0.42 0.36 10V VIN = VDD or VSS VOL = 0.5V 1.6 1.1 0.9 Minimum Output Low (Sink) Current IOL 15V VIN = VDD or VSS VOL = 1.5V 4.2 2.8 2.4 mA DC Electrical Characteristics (Voltages referenced to V SS) 3. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range VSS ≤ (VIN or VOUT) ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. 1. Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may reduce device reliability. 2. Measured in plastic DIP package, results in die form are dependent on die attach and assembly method. |
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