WNM3003

Absolute Maximum ratings

Parameter

Symbol

10 S

Steady State

Unit

Drain-Source Voltage

30

Gate-Source Voltage

±20

V

4.0

3.7

Continuous Drain Current

a

3.2

3.0

A

0.8

0.7

Maximum Power Dissipation

a

0.5

0.4

W

3.7

3.4

Continuous Drain Current

b

2.9

2.7

A

0.7

0.6

Maximum Power Dissipation

b

0.4

0.3

W

Pulsed Drain Current

c

10

A

Operating Junction Temperature

150

°C

Lead Temperature

260

°C

Storage Temperature Range

-55 to 150

°C

Thermal resistance ratings

Parameter

Symbol

Typical

Maximum

Unit

t

10 s

120

145

Junction-to-Ambient Thermal Resistance

a

Steady State

132

168

t

10 s

145

174

Junction-to-Ambient Thermal Resistance

b

Steady State

158

202

Junction-to-Case Thermal Resistance

Steady State

60

75

°C/W

a

Surface mounted on FR4 Board using 1 square inch pad size, 1oz copper

b

Surface mounted on FR4 board using minimum pad size, 1oz copper

c

d

Will Semiconductor Ltd.

2

2011 - Rev.1.1

Dec,