Parallel dual dicing saw with 6000 Series

features

Featuring parallel dual-spindles, DFD6450 combines the best aspects

of its predecessor, the DFD651, with the superior usability and process

quality of the DFD6000 Series Dicing Saws. Designed to handle a wide

range of dicing and grooving applications, the DFD6450 processes

silicon, compound semiconductor wafers, ceramics and other materials

used for electronic component applications. In addition, the DFD6450

also processes glass and other materials used for optical component

applications.

A parallel dual design unique to DISCO

The DFD6450's parallel dual spindle design is unique to DISCO and

offers several benefits. As the spindles are supported from the rear of

the machine, they are easily accessible from the front for blade

changes and other maintenance work. The design also supports

specialized applications such as mounting multiple blades on each

spindle for package singulation.

DFD6450

Next generation parallel dual dicing saw

Fully Automatic Dicing Saw

Improved usability



The 5-inch LCD touch panel with a Graphical User Interface allows for easy

and intuitive operation.



Shaft lock feature makes blade changes easy and quick.



Cutting water flow rate controller is programmable via the touch panel for

each individual device data.

Ｃontrol screen