DS1643/DS1643P

Nonvolatile Timekeeping RAM

www.artschip.com

8

POWER-UP/POWER-DOWN TIMING

CAPACITANCE

PARAMETER

SYMBOL

MIN

TYP

MAX

UNITS

NOTES

Capacitance on all pins

7

pF

Capacitance on all output pins

10

pF

AC TEST CONDITIONS

Output Load:

100pF +1TTL Gate

Input Pulse Levels:

0.0 to 3.0 Volts

Timing Measurement Reference Levels:

Input: 1.5V

Output: 1.5V

Input Pulse Rise and Fall Times: 5ns

Note:

1.

Voltages are referenced to ground.

2.

Typical values are at 25

℃ and nominal supplies.

3.

Outputs are open.

4.

The CE2 control signal functions exactly the same as the

signal except that the logic levels for active and inactive levels

are opposite.

5.

Data retention time is at 25

℃.

6.

defined for DIP modules as a cumulative time in the absence of Vcc starting from the time power is first applied by the user.

7.

Real-Time clock Modules (DIP) can be successfully processed through conventional wave-soldering techniques as long as

temperatures as long as temperature exposure to the lithium energy source contained within does not exceed +85

℃.

Post-solder cleaning with water washing techniques is acceptable, provided that ultrasonic vibration is not used.

In addition, for the PowerCap:

a.

ARTSCHIP Semiconductor recommends that PowerCap Module bases experience one pass through solder reflow

oriented with the label side up (“live-bug”).

flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply flux, heat the lead frame pad until

the solder reflow and use a solder wick to remove solder.