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LD8115 bảng dữ liệu(PDF) 10 Page - Leadtrend Technology |
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LD8115 bảng dữ liệu(HTML) 10 Page - Leadtrend Technology |
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10 / 12 page ![]() LD8115 03/10/2017 10 Leadtrend Technology Corporation www.leadtrend.com.tw LD8115-DS-00 March 2017 Thermal protection When the junction temperature reaches 130 C approximately, the thermal sensor signals would pull the OUT to Low. The Photo-coupler would limit the output voltage and reduce LED current. The thermal sensor will turn on CC/CV loop again after the IC ’s junction temperature cools by 30 C. PCB Design Guideline 1. The bypass capacitor of VCC should be placed as close as possible to the VCC and GND pin of IC. 2. Current Sense current loop should be as short as possible between the ISEN and LD8115 GND pin 3. The traces of LED current loop should be as strong and short as possible. 4. GND should be connected to a strong ground plane Fig. 12 7 8 6 5 1 2 3 4 ISEN VCC VREF DCDIM OUT GND ADIM VSEN VCC capacitor should be placed as close as possible to the VCC PIN Sense resistor should be placed as close as possible to the ISEN and GND pin VSEN Feedback resistor should be placed as close as possible to the VSEN and IC GND pin |
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