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FD0256f bảng dữ liệu(PDF) 4 Page - Feeling Technology Corp.

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FD0256f bảng dữ liệu(HTML) 4 Page - Feeling Technology Corp.

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FD0252f
FD0256f
Rev1.3 Dec. 18, 2008
P.4
FEELING
TECHNOLOGY
Absolute Maximum Ratings
Values
Parameter
Symbol Conditions
min.
typ.
max.
Unit
Operating Temperature
TOP
-
-20
105
℃
Storage Temperature
TST
-
-40
150
℃
DC Supply Voltage
VDD, VRD
-
6.5
V
PWMHIGH
-
>0.5VDD
6.5
V
PWM Voltage Range
PWMLOW
-
0
<0.14VDD
V
Supply Current
IDD
-
3
mA
Continuous Current
ICONT
-
500
mA
Hold Current
IHOLD
-
800
mA
RD Pin Sink Current
IRD
-
25
mA
Junction Temperature
TJ
-
170
℃
PDTS825
-
500
mW
Maximum Power Dissipation
PDTS826
-
520
mW
TS825
0.290
℃/mW
Thermal Resistance (note1)
θja
TS826
0.278
℃/mW
TS825
0.020
℃/mW
Thermal Resistance (note1)
θjc
TS826
0.018
℃/mW
Magnetic Flux Density
B
Unlimited
Gauss
IR-Reflow Lead Temperature
TP
10sec
260
℃
Note1: device mounted with copper area of approximately 10mm
2, 1ØZ, no air flow. (room temperature: 25
℃)
Figure.4
Figure.5
Figure.6
255 ± 5
oC
10 ± 1 sec
150 ± 10
oC
90 ± 30 sec
2~5
oC /sec
2~5
oC /sec
SECOND
IR-ReFlow Soldering Condition
0
25
50
75
100
125
150
328
414
500
Pd (mW)
Temp. (
)
o C
TS825 Power Dissipation Curve
175
242
156
70
0
105 oC
170 oC
0
25
50
75
100
125
150
340
430
520
Pd (mW)
Temp. (
)
o C
TS826 Power Dissipation Curve
175
250
160
70
0
105 oC
170 oC



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