12T08AFSW datasheet(6/7 Pages) NELLSEMI

6 / 7 page

Fig.11 Relative variation of critical rate of decrease

of main current versus junction temperature

(dI/dt)c [T ] (dl/dt)c [T specified ]

T (°C)

100

125

Fig.12 D PAK thermal resistance junction to

ambient versus copper surface under

tab (printed circuit board FR4, copper

thickness: 35µm)

Rth(j-a)(°C/W)

D PAK

S(cm )

Case Style

2.87 (0.113)

2.62 (0.103)

9.40 (0.370)

9.14 (0.360)

10.54 (0.415) MAX.

16.13 (0.635)

15.87 (0.625)

4.06 (0.160)

3.56 (0.140)

1.45 (0.057)

1.14 (0.045)

2.67 (0.105)

2.41 (0.095)

2.65 (0.104)

2.45 (0.096)

5.20 (0.205)

4.95 (0.195)

0.90 (0.035)

0.70 (0.028)

3.91 (0.154)

3.74 (0.148)

4.70 (0.185)

4.44 (0.1754)

1.39 (0.055)

1.14 (0.045)

3.68 (0.145)

3.43 (0.135)

8.89 (0.350)

8.38 (0.330)

29.16 (1.148)

28.40 (1.118)

14.22 (0.560)

13.46 (0.530)

0.56 (0.022)

0.36 (0.014)

2.79 (0.110)

2.54 (0.100)

15.32 (0.603)

14.55 (0.573)

TO-220AB

TO-263(D PAK)

2.79 (0.110)

0.36 (0.014)

2.79 (0.110)

2.29 (0.090)

1.40 (0.055)

1.19 (0.047)

0 to 0.254 (0 to 0.01)

1.40 (0.055)

1.14 (0.045)

4.83 (0.190)

4.06 (0.160)

10.45 (0.411)

9.65 (0.380)

6.22 (0.245)

9.14 (0.360)

8.13 (0.320)

15.00 (0.591)

0.940 (0.037)

0.686 (0.027)

2.67 (0.105)

2.41 (0.095)

5.20 (0.205)

4.95 (0.195)

15.85 (0.624)

3.56 (0.140)

0.53 (0.021)

www.nellsemi.com

Page 6 of 7

2(A2)

3(G)

1(A1)

12T Series RoHS

RoHS

12T08AFSW bảng dữ liệu(PDF) 6 Page - Nell Semiconductor Co., Ltd

12T08AFSW bảng dữ liệu(HTML) 6 Page - Nell Semiconductor Co., Ltd

Html Pages

1 2 3 4 5 6 7

bảng dữ liệu tải về

Link URL