NKD55 datasheet(3/6 Pages) NELLSEMI

3 / 6 page

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

UNIT

TEST CONDITIONS

VALUES

-40 to 150

0.33

0.1

115

Junction and storage temperature range

Maximum internal thermal resistance,

junction to case per leg

Typical thermal resistance,

case to heatsink per module

Mounting force, ±10%

Approximate weight

T ,T

J stg

RthJC

RthCS

DC operation

Mounting surface flat, smooth

and greased

ΔR

CONDUCTION

thJC

SINE HALF WAVE CONDUCTION

DEVICES

RECTANGULAR WAVE CONDUCTION

UNITS

°C

180°

120°

90°

60°

30°

0.115

0.136

0.173

0.236

0.346

0.09

0.145

0.185

0.243

0.349

• Table shows the increment of thermal resistance R

when devices operate at different conduction angles than DC

thJC

Note

180°

120°

90°

60°

30°

NKD55/NKJ55

to heatsink, M6

busbar, M5

A mounting compound is recommended

and the torque should be rechecked

after a period of 3 hours to allow for the

spread of the compound.

oz.

ADD-A-PAK (TO-240AA)

Case style

JEDEC

4.06

°C

°C/W

Page 3 of 6

www.nellsemi.com

Device code

NKD

Ordering Information Tabel

Module type, NKD/NKJ/NKC for ( Diode + Diode ) module

Current rating : IF(AV)

Voltage code x 100 = VRRM

Assembly type, ''A'' for soldering type

NKC55/NKE55

NKE for single diode

Nell High Power Products

RoHS

NKD55A/NKJ55A/NKC55A/NKE55A Series

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