AL1771/1772

Document number: DS41314 Rev. 1 - 2

19 of 24

www.diodes.com

August 2018

© Diodes Incorporated

AL1771/1772

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

TSSOP-16EP (Type DX)

SEATING PLANE

A2

A

D

A1

DETAIL 'A'

GAUGE PLANE

R1

R

L

L1

L2

0

02

SEE DETAIL 'A'

E2

D2

c

PIN 1

e

b

E

E/2

E1

1.350

1.050

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

TSSOP-16EP (Type DX)

C

Y2

X1

Y

X

X2

Y1

Y3

X3

Notes:

7. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These

dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is

calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT

Land Patterns, and for International grid details, please see document IEC, Publication 97.

8. For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between

device Terminals and PCB tracking.

TSSOP-16EP

(Type DX)

Dim

Min

Max

Typ

A

--

1.08

--

A1

0.05

0.15

--

A2

0.80

0.93

--

b

0.19

0.30

--

c

0.09

0.20

--

D

4.90

5.10

--

D2

2.70

--

--

E

6.40 BSC

E1

4.30

4.50

--

E2

2.50

--

--

e

0.65 BSC

L

0.45

0.75

--

L1

1.00 REF

L2

0.25 BSC

R

0.09

--

--

R1

0.09

--

--

θ

0°

8°

--

θ1

5°

15°

--

θ2

0°

--

--

All Dimensions in mm

Dimensions

Value

(in mm)

C

0.65

X

0.35

X1

2.94

X2

2.45

X3

4.90

Y

1.40

Y1

2.00

Y2

2.72

Y3

6.80