TSSD20L60SW datasheet(2/6 Pages) TSC

2 / 6 page

TSSD20L45SW - TSSD20L60SW

Taiwan Semiconductor

Version:B1702

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction-to-lead thermal resistance

RӨJL

°C/W

Junction-to-ambient thermal resistance

RӨJA

°C/W

Junction-to-case thermal resistance

RӨJC

°C/W

Thermal Performance Note: Units mounted on recommended PCB (16mm x 16mm Cu pad test board)

ELECTRICAL SPECIFICATIONS (T

A = 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage per diode

(1)

TSSD20L45SW

IF = 10A, TJ = 25°C

0.47

IF = 20A, TJ = 25°C

0.55

0.65

IF = 10A, TJ = 125°C

0.39

IF = 20A, TJ = 125°C

0.50

0.58

TSSD20L60SW

IF = 10A, TJ = 25°C

0.48

IF = 20A, TJ = 25°C

0.57

0.66

IF = 10A, TJ = 125°C

0.40

IF = 20A, TJ = 125°C

0.54

0.65

Reverse current @ rated VR

per diode

(2)

TSSD20L45SW

TJ = 25°C

100

µA

TJ = 125°C

TSSD20L60SW

TJ = 25°C

100

µA

TJ = 125°C

Junction capacitance

TSSD20L45SW

1 MHz, VR=4.0V

2600

TSSD20L60SW

2500

Notes:

Pulse test with PW=0.3 ms

Pulse test with PW=30 ms

ORDERING INFORMATION

PART NO.

PACKING

CODE

PACKING CODE

SUFFIX

PACKAGE

PACKING

TSSD20LxxSW

(Note 1, 2)

TO-252 (D-PAK)

2.5KPCS / 13"Reel

Notes:

1. "xx" defines voltage from 45V (TSSD20L45SW) to 60V (TSSD20L60SW)

2. Whole series with green compound (halogen-free)

EXAMPLE

EXAMPLE P/N

PART NO.

PACKING CODE

SUFFIX

DESCRIPTION

TSSD20L45SW ROG

TSSD20L45SW

Green compound

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