SC2616 datasheet(15/17 Pages) SEMTECH

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POWER MANAGEMENT

SC2616

Description

The MLP18 is a leadless package whose electrical

connections are made by lands on the bottom surface

of the component. These lands are soldered directly to

the PC board. The MLP has an exposed die attach pad,

which enhances the thermal and electrical characteristics

enabling high power applications. Power handling capability

of the MLP package is typically >2x the power of other

common SMT packages, such as the TSSOP and SOIC

packages. In order to take full advantage of this feature

the exposed pad must be physically connected to the

PCB substrate with solder.

Thermal Pad Via Design

Thermal data for the MLP18 is based on a 4 layer PCB

incorporating vias which act as the thermal path to other

layers. (Ref: Jedec Specification JESD 51-5). Based on

thermal performance, four-layer PCB’s with vias are

recommended to effectively remove heat from the device.

Vias should be 0.3mm diameter on a 1.2mm pitch, and

should be plugged to prevent voids being formed between

the exposed pad and PCB thermal pad due to solder

escaping by capillary action. Plugging can be accomplished

by “tenting” the via during the solder mask process. The

via solder mask diameter should be 100µm larger than

the via diameter.

Mounting Considerations

Two layer boards have less copper and thus typically

require an increase in the PC board area for effective

heatsinking. The copper area immdiately surrounding

the thermal pad connection must not be interupted by

routing traces.

Exposed Pad Stencil Design

It is good practice to minimize the presence of voids within

the exposed pad inter-connection. Total elimination is

difficult but the design of the exposed pad stencil is

important, a single slotted rectangular pattern is

recommended. (If large exposed pads are screened with

excessive solder, the device may “float”, thus causing a

gap between the MLP terminal and the PCB land

metalization.) The proposed stencil designs enables out-

gassing of the solder paste during reflow as well as

controlling the finished solder thickness.

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