DPG30IM300PC datasheet(3/5 Pages) IXYS

3 / 5 page

DPG30IM300PC

1) I

RMS is typically limited by the pin-to-chip resistance (1); or by the current capability of the chip (2). In case of (1) and a product

with multiple pins for one chip-potential, the current capability can be increased by connecting the pins as one contact.

Ratings

Product Marking

Date Code

Part No.

Logo

Assembly Code

XXXXXXXXX

IXYS Zyyww

000000

Assembly Line

300

Part number

Diode

HiPerFRED

extreme fast

Single Diode

TO-263AB (D2Pak) (2)

DPG60IM300PC

TO-263AB (D2Pak) (2)

300

Current Rating [A]

Reverse Voltage [V]

Package

Top

°C

175

virtual junction temperature

-55

Weight

Symbol

Definition

typ.

max.

min.

Conditions

operation temperature

Unit

mounting force with clip

RMS

RMS current

per terminal

150

-55

TO-263 (D2Pak)

Similar Part

Package

Voltage class

DSEP40-03AS

TO-263AB (D2Pak) (2)

300

Delivery Mode

Quantity

Code No.

Part Number

Marking on Product

Ordering

DPG30IM300PC

510002

Tape & Reel

800

DPG30IM300PC

Standard

stg

°C

150

storage temperature

-55

threshold voltage

0.7

mΩ

V0 max

R0 max

slope resistance *

7.8

Equivalent Circuits for Simulation

Fast

Diode

175 °C

* on die level

IXYS reserves the right to change limits, conditions and dimensions.

20131125b

Data according to IEC 60747and per semiconductor unless otherwise specified

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