IX4340

R05

www.ixysic.com

9

3.5.3 IX4340NTR & IX4340NETR Tape & Reel Dimensions

3.5.4 IX4340UE Package Dimensions

P1=8.00

A

W=12.0±0.3

K

K

B

Notes:

1. 10 sprocket hole pitch cumulative tolerance ±0.2.

2. Camber in compliance with EIA 481.

3. Pocket position relative to sprocket hole measured

as true position of pocket, not pocket hole.

4. All dimensions in millimeters.

330 DIA.

(13.00 inch DIA)

Embossed Carrier

Embossment

E

E1

b

e

D

A1

A2

A

0.10

D1

E2

‘A’

c

Gauge plane

Seating plane

L

L1

0.25

H

Notes:

1. JEDEC outline: Thermally enhanced: MO-187 AA-T.

2. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per end.

3. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the “b” dimension at maximum

material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shalll

not be less than 0.07mm.

4. D and E1 dimensions are determined at datum

.

5. The thermal pad on the bottom of the device may be connected to GND or left floating; it must not be connected to any other signal.

The thermal pad is not intended to carry current.

H

Detail ‘A’

V

W

X

Y

Z

Recommended PCB Land Pattern

A

A1

A2

b

c

D

D1

E

E1

E2

e

L

L1

V

W

X

Y

Z

MIN

-

0.00

0.75

0.22

0.08

1.42

1.38

0.40

0º

-

-

-

-

-

MILLIMETERS

NOM

-

-

0.85

-

-

3.00 BSC

-

4.90 BSC

3.00 BSC

-

0.65 BSC

0.60

0.95 REF

-

4.30

1.70

0.45

1.90

1.35

MAX

1.10

0.15

0.95

0.38

0.23

1.93

1.73

0.80

8º

-

-

-

-

-

MIN

-

0.00

0.030

0.009

0.003

0.056

0.054

0.016

0º

-

-

-

-

-

INCHES

NOM

-

-

0.033

-

-

0.118 BSC

-

0.193 BSC

0.118 BSC

-

0.026 BSC

0.024

0.037 REF

-

0.169

0.067

0.018

0.075

0.053

MAX

0.043

0.006

0.037

0.015

0.009

0.076

0.068

0.031

8º

-

-

-

-

-

LAND PATTERN