AD9554 datasheet(20/116 Pages) AD

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AD9554

Data Sheet

Rev. D | Page 20 of 116

Pin No.

Mnemonic

Input/

Output

Pin Type

Description

60, 61, 65,

66, 67

M5, M6, M7,

M8, M9

I/O

1.5 V/1.8 V

CMOS

Configurable Input/Output Pins. These pins are used for status and control of

the AD9554. These pins are also used at power-up and reset to determine the

serial port and address. See the Multifunction Pins at Reset/Power-Up section

for more information about the internal 100 kΩ pull-up or pull-down resistors.

These pins are on the VDD digital power domain (Pin 62), and the logic high

voltage for this pin matches the voltage of the VDD pins.

XOB

Differential

input

Complementary System Clock Input. Complementary signal to XOA. XOB

contains internal dc biasing and must be ac-coupled with a 0.1 μF capacitor

except when using a crystal. When a crystal is used, connect the crystal across

XOA and XOB.

XOA

Differential

input

System Clock Input. XOA contains internal dc biasing and must be ac-coupled

with a 0.1 μF capacitor except when using a crystal. When a crystal is used,

connect the crystal across XOA and XOB. Single-ended CMOS is also an option,

but a spur may be introduced if the duty cycle is not 50%. When using XOA as

a single-ended input, connect a 0.1 μF capacitor from XOB to ground.

LF_3

I/O

Loop filter for

APLL_3

Loop Filter Node for the APLL_3. Connect an external 15 nF capacitor from this

pin to Pin 69 (LDO_3).

LDO_3

LDO bypass

APLL_3 Loop Filter Voltage Regulator. Connect a 0.22 μF capacitor from this pin

to ground. This pin is also the ac ground reference for the integrated APLL_3

external loop filter.

OUT3B

HCSL, LVDS-

compatible,

LVPECL-

compatible

PLL3 Output 3B. This HCSL output can be configured as a LVDS- or LVPECL-

compatible output. LVPECL and LVDS levels can be achieved by ac-coupling

and using the Thevenin equivalent termination as described in the

Input/Output Termination Recommendations section.

EPAD

GND

Exposed pad

The exposed pad is the ground connection on the chip. It must be soldered to

the analog ground of the printed circuit board (PCB) to ensure proper

functionality and heat dissipation, noise, and mechanical strength benefits.

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