MMDS09254HT1 datasheet(2/16 Pages) NXP

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RF Device Data

Freescale Semiconductor, Inc.

MMDS09254HT1

Table 1. Maximum Ratings

Rating

Symbol

Value

Unit

Supply Voltage

VDD

Logic Inputs (SCLK, LCLK, LEN, PUP, SDI)

Vin

--0.5 to +3.63

RF Input Power (CW)

dBm

Storage Temperature Range

Tstg

--65 to +150

C

Junction Temperature

150

C

Table 2. Recommended Operating Conditions

Characteristic

Symbol

Min

Max

Unit

Supply Voltage

VDD

4.5

5.5

DC Input Voltage (SCLK, LCLK, LEN, SDI)

Vin

3.3

Table 3. Electrical Characteristics (VDD = 5 Vdc, 900 MHz, TA =25C, 50 ohm system, in Freescale Application Circuit)

Characteristic

Symbol

Min

Typ

Max

Unit

Insertion Loss (Includes 3 dB power division and 2.5 dB loss)

—

5.5

—

Max Transition Time (Rising Edge of LCLK to RFout)

ttransition

—

350

—

Power Input @ 1dB Compression

P1dB

—

dBm

Supply Current

IDD

Isolation (S32)

|S32|

—

Input Return Loss (S11)

IRL

—

Output Return Loss (S22, S33)

ORL

—

Third Order Output Intercept Point

OIP3

—

dBm

Phase Step



—

/bit

Phase Control Range



—



Attenuation Step

R

—

0.5

—

dB/bit

Attenuation Control Range

R

—

7.5

—

Max Input Voltage Logic Low

VIL

—

0.4

Min Input Voltage Logic High

VIH

1.6

—

SDO Output Voltage High

VOH

1.8(1)

—

0.6  VDD

SDO Output Voltage Low

VOL

—

0.4

Clock Frequency (50% Duty Cycle)

fSCLK

—

MHz

1. Load = 20 pF @ maximum clock frequency.

Table 4. Thermal Characteristics

Characteristics

Symbol

Value (2)

Unit

Thermal Resistance, Junction to Case

Case Temperature 105C, Pout = 0.02 W, Maximum Phase and

Attenuation State, Pin = 25 dBm CW, 900 MHz, VDD =5 Vdc,

IDD =11 mA

RJC

C/W

Table 5. ESD Protection Characteristics

Test Methodology

Class

Human Body Model (per JESD22--A114)

Machine Model (per EIA/JESD22--A115)

Charge Device Model (per JESD22--C101)

III

Table 6. Moisture Sensitivity Level

Test Methodology

Rating

Package Peak Temperature

Unit

Per JESD22--A113, IPC/JEDEC J--STD--020

260

C

2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf and search for AN1955.

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