TMUX1511PWR datasheet(4/22 Pages) TI1

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TMUX1511

SCDS390 – SEPTEMBER 2018

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VDD

Supply voltage(3)

–0.5

VSEL

Logic control input pin voltage (SEL1, SEL2, SEL3, SEL4) (3)

–0.5

ISEL

Logic control input pin current (SEL1, SEL2, SEL3, SEL4)

-30

VS or VD

Source or drain pin voltage(3)

–0.5

IS or ID (CONT)

Source and drain pin continuous current: (S1 to S4, D1 to D4)

-25

Tstg

Storage temperature

–65

150

°C

Junction temperature

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC

specification JESD22-C101(2)

±750

(1)

VS_off and VD_off refers to the voltage at the source or drain pins when supply is less than 1.5 V

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VDD

Supply voltage

1.5

5.5

VS or VD

Signal path input/output voltage (source or drain pin), VDD ≥ 1.5 V

5.5

VS_off or VD_off

Signal path input/output voltage (source or drain pin), VDD < 1.5 V

(1)

3.6

VSEL

Control input voltage (SELx pins)

5.5

Ambient temperature

–40

125

ºC

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

DEVICE

UNIT

PW (TSSOP)

RSV (UQFN)

14 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

129.4

TBD

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

58.8

TBD

°C/W

RθJB

Junction-to-board thermal resistance

72.4

TBD

°C/W

ΨJT

Junction-to-top characterization parameter

11.6

TBD

°C/W

YJB

Junction-to-board characterization parameter

71.9

TBD

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

TBD

°C/W

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