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FSUSB74 bảng dữ liệu(PDF) 10 Page - ON Semiconductor |
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FSUSB74 bảng dữ liệu(HTML) 10 Page - ON Semiconductor |
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10 / 12 page ![]() © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FSUSB74 • Rev. 1.0.2 9 Physical Dimensions Figure 18. 16-Lead, Quad Molded Leadless Package (MLP) Order Number Operating Temperature Range Package Description Packing Method FSUSB74MPX -40 to 85°C 16-Lead, Quad, Molded Leadless Package (MLP), 3mm x 3mm Tape & Reel Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. |
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