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10

Physical Dimensions

Figure 18. 12-Lead, Ultrathin Molded Leadless Package (UMLP)

Ordering Inform ation

Part Number Top Mark Operating Temperature Range

Package

FSUSB63UMX

KG

-40 to +85°C

12-Lead, Quad, Ultrathin Molded Leadless Package (UMLP),

1.8mm x 1.8mm x 0.55mm, 0.4mm pitch

Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the

most recent revision. Package specifications do not expand the terms of ON Semiconductor

’s worldwide terms and conditions, specifically the

warranty therein, which covers ON Semiconductor products.

A

B

C

SEATING

PLANE

RECOMMENDED

LAND PATTERN

NOTES:

A. PACKAGE DOES NOT FULLY CONFORM TO

JEDEC STANDARD.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. LAND PATTERN RECOMMENDATION IS

BASED ON FSC DESIGN ONLY.

E. DRAWING FILENAME: MKT-UMLP12Arev4.

SCALE : 2X

LEAD

OPTION 1

SCALE : 2X

LEAD

OPTION 2

DETAIL A

SCALE : 2X

PIN#1 IDENT

TOP VIEW

BOTTOM VIEW

0.10 C

0.08 C

0.10 C

2X

2X

SIDE VIEW

0.10 C

0.05

0.00

3

6

1

0.10 C A B

0.05 C

0.55 MAX.

12

1.80

1.80

0.40

0.25

0.15(12X)

0.35

0.45

2.10

2.10

0.40

0.563

(11X)

0.20

(12X)

1

0.152

9

0.588

DETAIL A

PIN#1 IDENT

(11X)

PACKAGE

EDGE

0.10

0.10

0.45

0.35

0.10