LOW SKEW 1 TO 4 CLOCK BUFFER

8

SEPTEMBER 20, 2018

551S DATASHEET

Package Outline Drawings

The package outline drawings are appended at the end of this document and are accessible from the link below. The package

information is the most current data available.

www.idt.com/document/psc/dcg8-package-outline-drawing-0150-body-width-0050-pitch-soic

www.idt.com/document/psc/cmg8-package-outline-drawing-20-x-20-x-05-mm-body-05mm-pitch-dfn

Ordering Information

“G” suffix to the part number denotes Pb-Free configuration, RoHS compliant.

Revision History

Part / Order Number

Marking

Shipping Packaging

Package

Temperature

551SDCGI

see page 7

Tubes

8-pin SOIC

-40 to +105

C

551SDCGI8

Tape and Reel

8-pin SOIC

-40 to +105

C

551SCMGI

Cut Tape

8-pin DFN

-40 to +105

C

551SCMGI8

Tape and Reel

8-pin DFN

-40 to +105

C

Date

Description of Change

September 20, 2018

• Added Thermal Resistance Junction to Board to Thermal Characteristics table.

• Updated Package Outline Drawings section.

March 18, 2015

Initial release.