Microsemi

Integrated Products, Power Management

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 2

Copyright

© 2000

Rev. 1.0a, 2004-06-14

LX1671

Multiple Output LoadSHARE™ PWM

I N T E GRA T ED

PR ODUC T S

ABSOLUTE MAXIMUM RATINGS

Operating Junction Temperature.................................................................. 150°C

Storage Temperature Range...........................................................-65°C to 150°C

Lead Temperature (Soldering 180 seconds) ................................................ 235°C

Note:

Exceeding these ratings could cause damage to the device. All voltages are

with respect to Ground. Currents are positive into, negative out of specified

terminal.

The limitation on transient time is thermal and is due to zener diodes on the

supply pins, application of maximum voltages will increase current into that

pin and increase package power dissipation..

x = Denotes Phase 1, 2, or 3

TH ERMAL DATA

PW

Plastic TSSOP 38-Pin

THERMAL RESISTANCE

85

°C/W

LQ

Plastic MLP 38-Pin

THERMAL RESISTANCE

35

°C/W

system. All of the above assume no ambient airflow.

PACKAGE PIN OUT

1

19

38

20

LO1

PG1

LO2

HO2

VC2

LDGD

LDFB

LDDIS

DGND

AGND

RSVD

SS2

RF2

FB2

EO2

CS2

VS2

SS1

FB1

EO1

CS1

VS1

SS3

FB3

EO3

CS3

VS3

VCC

VCCL

PG3

LO3

HO3

VC3

VC1

H01

N.C.

N.C.

N/U

(Top View)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

HO2

VC2

LDGD

LDFB

LDDIS

DGND

AGND

SS2

RF2

FB2

EO2

SS3

FB3

EO3

N.C.

CS3

VS3

N.C.

N.C.

VCC

VCCL

PG3

RSVD

LO3

Connect

Bottom

to Power

GND

(Top View)

N.C. – No Internal Connection

N/U – Not Used

RSVD – Do Not Use