A141

DF9 Series

BPrecautions for Use

1. Recommended Temperature Profile (SMT)

Note1 : Up to 2 cycles of Reflow soldering are possible under the same conditions, provided

that there is a return to normal temperature between the first and second cycle.

Note2 : The temperature profile indicates the board surface temperature at the point of contacts

with the connector terminals.

2. Recommended Manual Soldering Condition (SMT)

Soldering iron temperature: 370

±10ç, Soldering time: Within 3 seconds

3. Recommended Screen Thickness (SMT)

0.15mm

4. Board Warp(SMT)

Maximum 0.03mm in the connector center area, based on both connector edges.

5. Cleaning Condition

Refer to the "Nylon Connector Use Hand book".

6. Cautions

■ Avoid retaining the board with the connector only, and fix the board by any other means than the connector.

■ Where the board is not mounted, the insertion or extraction will cause damage or deformation in contacts.

■ Excessive scoop insertion or extraction may result in damage.

■ In the manual soldering process, don't carry out flux coating which will cause a flux blister on the connector.

■ The color phase of this product may be slightly different from that of the forming product according to the

manufacturing lot. However, the difference doesn't affect the performance.

50

60sec max

Soldering

100

150

200

250

Time (sec.)

Temperature (ç)

0

100

150

200

250

50

Room temperature

300

90~120sec

Preheating

180ç

250ç

220ç

150ç