MDS 2309 D

6

Revision 052405

In te gr ated Circuit Systems

ICS2309

Package dimensions are kept current with JEDEC Publication No. 95

Thermal Characteristics for 16TSSOP

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Thermal Resistance Junction to

Ambient

θ

JA

Still air

78

°C/W

θ

JA

1 m/s air flow

70

°C/W

θ

JA

3 m/s air flow

68

°C/W

Thermal Resistance Junction to Case

θ

JC

37

°C/W

INDEX

AREA

1 2

16

D

E1

E

SEATING

PLANE

A

1

A

A

2

e

- C -

b

.10 (.004)

C

c

L

Millimeters

Inches

Symbol

Min

Max

Min

Max

A

--

1.20

--

0.047

A1

0.05

0.15

0.002

0.006

A2

0.80

1.05

0.032

0.041

b

0.19

0.30

0.007

0.012

C

0.09

0.20

0.0035

0.008

D

4.90

5.1

0.193

0.201

E

6.40 BASIC

0.252 BASIC

E1

4.30

4.50

0.169

0.177

e

0.65 Basic

0.0256 Basic

L

0.45

0.75

0.018

0.030

α

0

°

8

°

0

°

8

°