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BGS8H2 bảng dữ liệu(PDF) 6 Page - NXP Semiconductors |
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BGS8H2 bảng dữ liệu(HTML) 6 Page - NXP Semiconductors |
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6 / 15 page ![]() NXP Semiconductors BGS8H2 SiGe:C low-noise amplifier MMIC with bypass switch for LTE BGS8H2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved. Product data sheet Rev. 3 — 29 June 2018 COMPANY CONFIDENTIAL 6 / 15 9 Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). See legal section: "disclaimers" paragraph "Limiting values". Symbol Parameter Conditions Min Max Unit VCC supply voltage RF input AC coupled [1] -0.5 +5.0 V VI(CTRL) input voltage on pin CTRL VI(CTRL) < VCC + 0.6 V [1][2] -0.5 +5.0 V VI(RF_IN) input voltage on pin RF_IN DC; VI(RF_IN) < VCC + 0.6 V [1][2] -0.5 +5.0 V VI(RF_OUT) input voltage on pin RF_OUT DC; VI(RF_OUT) < VCC + 0.6 V [1][2][3] -0.5 +5.0 V Pi input power [1] - 26 dBm Ptot total power dissipation Tsp ≤ 130 °C - 55 mW Tstg storage temperature -65 +150 °C Tj junction temperature - 150 °C Human Body Model (HBM) according to ANSI/ESDA/JEDEC standard JS-001 - ±2 kV VESD electrostatic discharge voltage Charged Device Model (CDM) according to JEDEC standard JESD22-C101C - ±1 kV [1] Stressed with pulses of 1 s in duration. VCC connected to a power supply of 2.8 V with 500 mA current limit. [2] Warning: Due to internal ESD diode protection, to avoid excess current, the applied DC voltage must not exceed VCC + 0.6 V or 5.0 V. [3] The RF input and RF output are AC coupled through internal DC blocking capacitors. 10 Recommended operating conditions Table 6. Operating conditions Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage [1] 1.5 - 3.1 V Tamb ambient temperature -40 +25 +85 °C OFF state - - 0.3 V VI(CTRL) input voltage on pin CTRL ON state 0.8 - Vcc V [1] Stressed with pulses of 1 s in duration. VCC connected to a power supply with 500 mA current limit. 11 Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-sp) thermal resistance from junction to solder point 225 K/W |
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