© 2001 Fairchild Semiconductor Corporation

www.fairchildsemi.com

KA393 / KA2903 • Rev. 1.0.3

6

Physical Dimensions

Figure 1. 8-Lead, DIP, JEDEC MS-001, .300" Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

C

7° TYP

7° TYP

.430 MAX

[10.92]

B

A

.400

.373

9.46

]

.250±.005 [6.35±0.13]

.036 [0.9 TYP]

.070

.045

1.14

]

.100

[2.54]

.300

[7.62]

.060 MAX

[1.52]

.310±.010 [7.87±0.25]

.130±.005 [3.3±0.13]

.210 MAX

[5.33]

.140

.125

3.17

]

.015 MIN

[0.38]

.021

.015

0.37

]

.010

+.005

-.000

-0.000

]

PIN #1

PIN #1

(.032) [R0.813]

(.092) [Ø2.337]

TOP VIEW

OPTION 1

TOP VIEW

OPTION 2

.001[.025]

C

N08EREVG

C. DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

DAMBAR PROTRUSIONS SHALL NOT EXCEED

D. DOES NOT INCLUDE DAMBAR PROTRUSIONS.

B. CONTROLING DIMENSIONS ARE IN INCHES

A. CONFORMS TO JEDEC REGISTRATION MS-001,

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED

VARIATIONS BA

E. DIMENSIONING AND TOLERANCING

NOTES:

REFERENCE DIMENSIONS ARE IN MILLIMETERS

.010 INCHES OR 0.25MM.

.010 INCHES OR 0.25MM.

PER ASME Y14.5M-1994.