4

TMUX1072

SCDS382 – APRIL 2018

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Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

–0.5

6

V

–0.5

20

V

–0.5

6

V

Digital input voltage (SEL1, SEL2, OE)

–0.5

6

V

Digital output voltage (FLT)

–0.5

6

V

Input-output port diode current (COM1,

COM2,NC1, NO1, NC2, NO2)

–50

mA

Digital logic input clamp current (SEL1,

–50

mA

Continuous current through VCC

100

mA

Continuous current through GND

–100

mA

Storage temperature

–65

150

°C

Operating Junction Temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2000

V

±1000

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

2.3

5.5

V

Analog input/output

COM1, COM2

0

18

V

(NC1, NO1, NC2, NO2)

0

5.5

V

COM1, COM2

-50

50

mA

(NC1, NO1, NC2, NO2)

-50

50

mA

Digital input voltage

SEL1, SEL2, OE

0

5.5

V

Digital output voltage

FLT

0

5.5

V

Analog input/output port continuous current

(COM1, COM2, NC1, NO1,

NC2, NO2)

-50

50

mA

Digital output current

3

mA

Operating free-air temperature

–40

85

ºC

Junction temperature

–40

125

ºC