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TPA3138D2PWPR bảng dữ liệu(PDF) 5 Page - Texas Instruments

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TPA3138D2
www.ti.com
SLOS993A – MARCH 2018 – REVISED JUNE 2018
Product Folder Links: TPA3138D2
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The voltage slew rate of these pins must be restricted to no more than 10 V/ms. For higher slew rates, use a 100 kΩ resister in series
with the pins.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage
AVCC to GND, PVCC to GND
–0.3
20
V
Input current
To any pin except supply pins
10
mA
Interface pin voltage
SD/FAULT to GND(2), GAIN_SEL, MODE_SEL
–0.3
AVCC + 0.3
V
10
V/ms
PLIMIT
-0.3
GVDD + 0.3
V
RINN, RINP, LINN, LINP
–0.3
5.5
V
Minimum load resistance, RL
BTL, (10 V < PVCC < 14.4 V)
4.8
Ω
BTL, (3.5 V < PVCC < 10 V)
3.2
PBTL, (10 V < PVCC < 14.4 V)
2.4
PBTL, (3.5 V < PVCC < 10 V)
1.6
Continuous total power dissipation
See the Thermal
Information Table
Operating Juncation Temperature range
–25
150
°C
Storage temperature range, Tstg
–40
125
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
V
Charged device model (CDM), per JEDEC specification JESD22-C101 (2)
±250



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