DATASHEET

Lamp

EALP05RDJYA3

8

Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 26.Nov.2012. Issue No: 1 Rev:1

www.everlightamericas.com

Prehead

laminar wave

Fluxing

Recommended soldering profile

Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.

Dip and hand soldering should not be done more than one time

After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return

to room temperature.

A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest

possible temperature is desirable for the LEDs.

Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the

solder wave.

4.

Cleaning

When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than

one minute. Dry at room temperature before use.

Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the

LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be

pre-qualified to ensure this will not cause damage to the LED

5.

Heat Management

Heat management of LEDs must be taken into consideration during the design stage of LED application. The current

should be de-rated appropriately by referring to the de-rating curve found in each product specification.

The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating

curve.