Data Sheet

HMC674LC3C/HMC674LP3E

Rev. K | Page 11 of 14

APPLICATIONS INFORMATION

EVALUATION PRINTED CIRCUIT BOARD (PCB)

Figure 13 shows the front side of the evaluation PCB, and

Figure 14 shows the back side of the evaluation PCB.

The evaluation PCB used in the application must use RF circuit

design techniques. Signal lines must have 50 Ω impedance, and

the package ground leads must be connected directly to the ground

plane similar to that shown in Figure 15. Use a sufficient number

of via holes to connect the top and bottom ground planes to

provide good RF grounding to 10 GHz. The evaluation PCB shown

in Figure 13 is available from Analog Devices, Inc., upon request.

Figure 13. Front Side of the Evaluation PCB

Figure 14. Back Side of the Evaluation PCB