ADA4432-1BCPZ-R2 datasheet(6/25 Pages) AD

6 / 25 page

ADA4432-1/ADA4433-1

Data Sheet

Rev. E | Page 6 of 25

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

4 V

Output Common-Mode Voltage

22 V

Input Differential Voltage

+VS

Power Dissipation

See Figure 3

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering, 10 sec)

260°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the device soldered to a high thermal

conductivity 4-layer (2s2p) circuit board, as described in

EIA/JESD 51-7.

Table 4.

Package Type

θJA

θJC

Unit

6-Lead SOT-23

170

Not applicable

°C/W

8-Lead LFCSP

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADA4432-1 and

ADA4433-1 packages are limited by the associated rise in

junction temperature (TJ) on the die. At approximately 150°C,

which is the glass transition temperature, the plastic changes its

properties. Exceeding a junction temperature of 150°C for an

extended time can result in changes in the silicon devices,

potentially causing failure.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS). The power dissipated due to the load drive

depends on the particular application. For each output, the

power due to load drive is calculated by multiplying the load

current by the associated voltage drop across the device. The

power dissipated due to the loads is equal to the sum of the

power dissipations due to each individual load. RMS voltages

and currents must be used in these calculations.

Airflow increases heat dissipation, effectively reducing θJA.

Figure 3 shows the maximum power dissipation in the package

vs. the ambient temperature for the 6-lead SOT-23 (170°C/W)

and the 8-lead LFCSP (50°C/W) on a JEDEC standard 4-layer

board. θJA values are approximate.

Figure 3. Maximum Power Dissipation vs.

Ambient Temperature for a 4-Layer Board

ESD CAUTION

–40

–20

100

120

AMBIENT TEMPERATURE (ºC)

TJ = 150°C

LFCSP

SOT-23

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