4

ESDS312, ESDS314

SLVSEG9A – MAY 2018 – REVISED JULY 2018

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(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

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MIN

MAX

UNIT

IEC 61000-4-4

Electrical Fast

Transient

Peak Power at 25 °C

80

A

IEC 61000-4-5

µs

Peak Power at 25 °C

170

W

Peak Current at 25 °C

25

A

Operating free-air temperature

–40

125

°C

Storage temperature

–65

155

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. [Following sentence

optional; see the wiki.] Manufacturing with less than 500-V HBM is possible with the necessary precautions. [Following sentence

optional; see the wiki.] Pins listed as ±WWW V and/or ±XXX V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. [Following sentence

optional; see the wiki.] Manufacturing with less than 250-V CDM is possible with the necessary precautions. [Following sentence

optional; see the wiki.] Pins listed as ±YYY V and/or ±ZZZ V may actually have higher performance.

6.2 ESD Ratings -JEDEC Specifications

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per

±2500

V

Charged device model (CDM), per JEDEC

±1000

6.3 ESD Ratings - IEC Specifications

VALUE

UNIT

Electrostatic discharge

IEC 61000-4-2 Contact Discharge, all pins

±30000

V

IEC 61000-4-2 Air Discharge, all pins

±30000

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

0

3.6

V

Operating Free Air Temperature

–40

125

°C

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For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information

ESDS314, ESDS312

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

224.3

°C/W

Junction-to-case (top) thermal resistance

166.1

°C/W

Junction-to-board thermal resistance

68.4

°C/W

Junction-to-top characterization parameter

57.3

°C/W

Junction-to-board characterization parameter

67.9

°C/W

Junction-to-case (bottom) thermal resistance

TBD

°C/W