X9110

FN8158 Rev 5.00

Page 18 of 18

October 28, 2016

Package Outline Drawing

M14.173

14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)

Rev 3, 10/09

DETAIL "X"

SIDE VIEW

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

B

A

17

8

14

C

PLANE

SEATING

0.10 C

0.10

CBA

H

PIN #1

I.D. MARK

5.00 ±0.10

4.40 ±0.10

0.25 +0.05/-0.06

6.40

0.20 C B A

0.05

0°-8°

GAUGE

PLANE

SEE

0.90 +0.15/-0.10

0.60 ±0.15

0.09-0.20

5

2

3

1

3

1.00 REF

0.65

1.20 MAX

0.25

0.05 MIN

0.15 MAX

(1.45)

(5.65)

(0.65 TYP)

(0.35 TYP)

DETAIL "X"

1. Dimension does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.

2. Dimension does not include interlead flash or protrusion. Interlead

flash or protrusion shall not exceed 0.25 per side.

3. Dimensions are measured at datum plane H.

4. Dimensioning and tolerancing per ASME Y14.5M-1994.

5. Dimension does not include dambar protrusion. Allowable protrusion

shall be 0.80mm total in excess of dimension at maximum material

condition. Minimum space between protrusion and adjacent lead is 0.07mm.

6. Dimension in ( ) are for reference only.

7. Conforms to JEDEC MO-153, variation AB-1.

NOTES:

END VIEW

For the most recent package outline drawing, see M14.173.