Document Number: 002-00515 Rev. *G

Page 13 of 17

S34MS08G2

8.3

Pin Capacitance

Note

16. For the stacked devices version the Input is 10 pF x [number of stacked chips] and the Input/Output is 10 pF x [number of stacked chips].

8.4

Power Consumptions and Pin Capacitance for Allowed Stacking

Configurations

When multiple dies are stacked in the same package, the power consumption of the stack will increase according to the number of

chips. As an example, the standby current is the sum of the standby currents of all the chips, while the active power consumption

depends on the number of chips concurrently executing different operations.

When multiple dies are stacked in the same package the pin/ball capacitance for the single input and the single input/output of the

combo package must be calculated based on the number of chips sharing that input or that pin/ball.

Table 8. Pin Capacitance (TA = 25°C, f=1.0 MHz)

Parameter

Symbol

Test Condition

Min

Max

Unit

Input

—

10

pF

Input / Output

—

10