LTPL-C095WPRB datasheet(4/15 Pages) LITEON

4 / 15 page

3/14

Part No. : LTPL-C095WPRB

BNS-OD-FC002/A4

SMD LED

LTPL-C095WPRB

3.2 Suggest IR Reflow Condition For Pb Free Process:

Profile Feature

Lead Free Assembly

Average Ramp-Up Rate (TSmax to TP)

3°C / second max

Preheat Temperature Min (TSmin)

150°C

Preheat Temperature Max (TSmax)

200°C

Preheat Time (tSmin to tSmax)

60 – 120 seconds

Time Maintained Above Temperature (TL)

217°C

Time Maintained Above Time (tL)

60 – 150 seconds

Peak / Classification Temperature (TP)

260°C

Time Within 5°C of Actual Peak Temperature (t P)

5 seconds

Ramp – Down Rate

6°C / second max

Time 25°C to Peak Temperature

8 minutes max

Notes:

All temperatures refer to topside of the package, measured on the package body surface.

The soldering condition referring to J-STD-020D.

The soldering profile could be further referred to different soldering grease material characteristic. The grease

vendor will provide this information.

A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.

Although the recommended reflow conditions are specified above, the reflow or hand soldering condition at the

lowest possible temperature is desirable for the LEDs.

LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip soldering method.

LTPL-C095WPRB bảng dữ liệu(PDF) 4 Page - Lite-On Technology Corporation