Pad Assignment

Pad Coordinates

Unit:

mm

Pad No.

X

Y

1

-610.00

701.90

2

-622.00

461.60

3

-622.00

350.60

4

-622.00

239.70

5

-616.00

-695.20

6

-502.00

-695.20

7

-388.50

-687.70

8

-87.95

-647.80

9

575.80

172.40

10

575.80

444.20

11

308.30

660.40

12

22.10

635.90

13

-122.40

638.40

14

-270.40

701.90

15

-384.50

701.90

16

-495.50

701.90

Chip Size: 1530

´ 1690 mm

* The IC substrate should be connected to VSS in the PCB layout artwork.

Pin Description

Pin No.

Pin Name

I/O

Internal Connection

Description

1~8

A0~A7

I

NMOS

Open Drain

Address pin.

9

VSS

¾¾

Negative power supply, ground

10

AUD

O

PMOS

Open Drain

Audio out

11

DIN

I

COMS In

Serial data input

12

AMP

O

CMOS

Amp feed back

13

OSCI

I

¾

Oscillator input pin.

14

VT

O

CMOS

Busy, data valid

15

TEST

I

CMOS In

Test pin.

16

VDD

¾¾

Positive power supply

Absolute Maximum Ratings

Supply Voltage ........................................

-0.3V to 5.5V

Storage Temperature ...........................

-50°Cto125°C

Operating Temperature ..........................

-25°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

HT12M

Rev. 1.00

2

March 25, 2002

( 0 , 0 )

1

2

3

4

5

1 6

6

7

8

A 6 A 7 V S S

A U D

1 0

9

A M P

D I N

1 5 1 4

1 3

1 2

1 1

A 2

A 3

A 4

A 5