S34ML08G2 datasheet(13/16 Pages) CYPRESS

13 / 16 page

Document Number: 002-00484 Rev. *I

Page 13 of 16

S34ML08G2

9.1.2

63-Pin Ball Grid Array (BGA)

Figure 7. VLD063 — 63-Pin BGA, 11 mm x 9 mm Package

g5013 \ 16-038.28 \ 6.5.13

NOTES:

1. DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

2. ALL DIMENSIONS ARE IN MILLIMETERS.

3. BALL POSITION DESIGNATION PER JEP95, SECTION

3, SPP-020.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE

"D" DIRECTION.

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

n IS THE TOTAL NUMBER OF POPULATED SOLDER

BALL POSITIONS FOR MATRIX SIZE MD X ME.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

“SD” AND “SE” ARE MEASURED WITH RESPECT TO DATUMS

A AND B AND DEFINE THE POSITION OF THE CENTER

SOLDER BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN

THE OUTER ROW “SD” OR “SE” = 0.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN

THE OUTER ROW, “SD” = eD/2 AND “SE” = eE/2.

8. "+" INDICATES THE THEORETICAL CENTER OF

DEPOPULATED BALLS.

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

PACKAGE

VLD 063

JEDEC

M0-207(M)

11.00 mm x 9.00 mm

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

---

1.00

PROFILE

0.25

---

BALL HEIGHT

11.00 BSC.

BODY SIZE

9.00 BSC.

BODY SIZE

8.80 BSC.

MATRIX FOOTPRINT

7.20 BSC.

MATRIX FOOTPRINT

MATRIX SIZE D DIRECTION

MATRIX SIZE E DIRECTION

BALL COUNT

0.40

0.45

0.50

BALL DIAMETER

0.80 BSC.

BALL PITCH

0.80 BSC.

BALL PITCH

0.40 BSC.

SOLDER BALL PLACEMENT

0.40 BSC.

SOLDER BALL PLACEMENT

A3-A8,B2-B8,C1,C2,C9,C10

DEPOPULATED SOLDER BALLS

D1,D2,D9,D10,E1,E2,E9,E10

F1,F2,F9,F10,G1,G2,G9,G10

H1,H2,H9,H10,J1,J2,J9,J10

K1,K2,K9,K10

L3-L8,M3-M8

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