HIP4081A

FN3659 Rev 8.00

Page 17 of 17

September 15, 2015

Package Outline Drawing

M20.3

20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)

Rev 3, 2/11

7. The lead width as measured 0.36mm (0.14 inch) or greater above

the seating plane, shall not exceed a maximum value of 0.61mm

DETAIL "X"

SIDE VIEW

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

13.00

0.75

0.25

x 45°

0.32

0.23

MAX

8°

1.27

0.40

10.65

10.00

7.60

7.40

20

12

3

INDEX

AREA

2.65

2.35

0.30

MAX

BSC

1.27

0.35

0.49

0.25 (0.10) MC

S

B

M

A

0.10 (0.004)

0.25 (0.10) MB M

1

2

1.27 BSC

(9.40mm)

SEATING PLANE

(0.60)

(2.00)

2

20

3

3

5

7

NOTES:

1. Dimensioning and tolerancing per ASME Y14.5M-1994.

2. Dimension does not include mold flash, protrusions or gate

3. Dimension does not include interlead lash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

4. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

5. Dimension is the length of terminal for soldering to a substrate.

6. Terminal numbers are shown for reference only.

8. Controlling dimension: MILLIMETER.

9. Dimensions in ( ) for reference only.

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

(0.024 inch)

10. JEDEC reference drawing number: MS-013-AC.

12.60