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HIP4086 bảng dữ liệu(PDF) 17 Page - Renesas Technology Corp

tên linh kiện HIP4086
Giải thích chi tiết về linh kiện  80V, 500mA, 3-Phase MOSFET Driver
PDF  17 Pages
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nhà sản xuất  RENESAS [Renesas Technology Corp]
Trang chủ  http://www.renesas.com
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HIP4086, HIP4086A
FN4220 Rev 1.00
Page 17 of 17
January 12, 2017
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JEDEC
seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold
flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendicular
to datum
.
7. eB and eC are measured at the lead tips with the leads unconstrained. eC
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6
will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
CL
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C A
M
BS
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8
C
0.008
0.014
0.204
0.355
-
D
1.230
1.280
31.24
32.51
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N24
24
9
Rev. 0 12/93
For the most recent package outline drawing, see E24.3.



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