HMC8410

Data Sheet

Rev. A | Page 16 of 17

EVALUATION BOARD SCHEMATIC

J1

C15

20pF

C2

10nF

C14

4.7µF

C13

100nF

VDD

C5

2.2µF

C4

100nF

C8

DNI

C7

DNI

J2

RFOUT

L2

590nH

J8

J3

J4

GND

THRU CAL

C9

DNI

DNI

DNI

DNI

C10

J6

J7

R1

0Ω

R2

15Ω

C16

20pF

C3

DNI

C12

DNI

6

5

1

2

3

4

GND

NIC

NIC

NIC

HMC8410

EPAD

J5

DNI

RFIN

L1

590nH

C1

10nF

C6

DNI

+

Figure 40. HMC8410 Evaluation Board Schematic

Table 6. Bill of Materials for Evaluation PCB EV1HMC8410LP2F

Item

Description

J1, J2

PCB mount SMA RF connectors, SRI 21-146-1000-01

J3, J4, J8

DC bias test points

C1, C2

Capacitors, broadband, 10 nF and 82 pF, 0502, 160 kHz and 40 GHz; Presidio Components MBB0502X103MLP5N8L

C3, C6 to C10, C12, J5 to J7

Do not install (DNI)

C4, C13

Capacitors, ceramic, 100 nF, 0402 package

C5

Capacitor, tantalum, 2.2 μF, Size A

C14

Capacitor, tantalum, 4.7 μF, 3216 package

C15, C16

Capacitors, ceramic, 20 pF, 0402 package

L1, L2

Inductors, 590 nH, 0402, 5%, ferrite DF, Coilcraft 0402DF-591XJRU

R1

0 Ω resistor

R2

15 Ω resistor, 0402 package

U1

Amplifier, HMC8410

Heat sink

Heat sink

PCB

600-01660-00 evaluation PCB; circuit board material: Rogers 4350