GC01MPS12-252

1200 V SiC MPS™ Diode

Feb 2018 Rev1.1

http://www.genesicsemi.com/sic_rectifiers_diodes/merged_pin_schottky/

Package Dimensions:

TO-252-2L

Recommended Solder Pad Layout

NOTE

1. CONTROLLED DIMENSION IS INCH. DIMENSION IN BRACKET IS MILLIMETER.

2. DIMENSIONS DO NOT INCLUDE END FLASH, MOLD FLASH, MATERIAL PROTRUSIONS

0.265 (6.73)

0.252 (6.40)

0.215 (5.46)

0.205 (5.21)

0.245 (6.22)

0.236 (6.00)

0.050 (

0.035 (0

0.409 (

0.370

0.045 (1.14)

0.030 (0.77)

0.035 (0

0.025 (0

0.090 BSC

(2.286 BSC)

0.180 BSC

(4.572 BSC)

0.236 (6.00)

0.118 (3.00)

0.055 (1.40)

0.055 (1

0.090 (2.29)

0.090 (2.29

0.256 (6.50)

0.246 (6.

http://www.genesicsemi.com/sic_rectifiers_diodes/merged_pin_schottky/

PACKAGE OUTLINE

1. CONTROLLED DIMENSION IS INCH. DIMENSION IN BRACKET IS MILLIMETER.

2. DIMENSIONS DO NOT INCLUDE END FLASH, MOLD FLASH, MATERIAL PROTRUSIONS

1.27)

0.89)

(10.40)

(9.40)

0.88)

0.64)

0.094 (2.38)

0.087 (2.20)

0.023 (0.58)

0.018 (0.46)

SEATING

PLANE

0.005 (0.127) max

0.070 (1.77)

0.055 (1.40)

0.020 BSC

(0.508 BSC)

0.173

min

0.023 (0.58)

0.018 (0.46)

.40)

29)

25)

http://www.genesicsemi.com/sic_rectifiers_diodes/merged_pin_schottky/

Page 5 of 6

0.205 (5.21)

min

173 (4.40)

min

0.1080 REF

(2.743 REF)