LTM8049 datasheet(16/20 Pages) LINER

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LTM4661

4661f

For more information www.linear.com/LTM4661

Figure 15 shows a measured thermal picture of the

LTM4661 running from 3.3V input to 12V output at 0.8A

DC current with 200LFM airflow and no heat sink.

Figure 15. Thermal Image, 3.3V Input to 12V Output at 0.8A,

200LFM Air Flow, No Heat Sink

Safety Considerations

The LTM4661 modules do not provide galvanic isolation

from VIN to VOUT. There is no internal fuse. If required,

a slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure. The device does support thermal

shutdown and overcurrent protection.

Layout Checklist/Example

The high integration of LTM4661 makes the PCB board

layoutverysimpleandeasy.However,tooptimizeitselectri-

cal and thermal performance, some layout considerations

are still necessary.

• Use large PCB copper areas for high current paths,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Placehighfrequencyceramicinputandoutputcapaci-

tors next to the VIN, PGND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• Tominimizetheviaconductionlossandreducemodule

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put vias directly on the pad, unless they are

capped or plated over.

• For parallel modules, tie the VOUT, VFB and COMP

pins together. Use an internal layer to closely connect

these pins together.

• Bring out test points on the signal pins for monitoring.

Figure 16givesagoodexampleoftherecommendedlayout.

APPLICATIONS INFORMATION

Figure 16. Recommended PCB Layout

VIN

GND

VOUT

4661 F16

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