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ADL5320ARKZ-R7 bảng dữ liệu(PDF) 13 Page - Analog Devices |
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ADL5320ARKZ-R7 bảng dữ liệu(HTML) 13 Page - Analog Devices |
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13 / 20 page ![]() Data Sheet ADL5320 SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN Figure 35 shows the recommended land pattern for the ADL5320. To minimize thermal impedance, the exposed paddle on the SOT-89 package underside is soldered down to a ground plane along with Pin 2. If multiple ground layers exist, stitch them together using vias. For more information on land pattern design and layout, refer to the Application Note AN-772, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). The land pattern on the ADL5320 evaluation board provides a measured thermal resistance (θJA) of 35°C/W. To measure θJA, the temperature at the top of the SOT-89 package is found with an IR temperature gun. Thermal simulation suggests a junction temperature 10°C higher than the top of the package temperature. With additional ambient temperature and input/output power measurements, θJA can be determined. 1.50mm 3.00mm 1.80mm 0.86mm 0.762mm 0.635mm 0.86mm 0.20mm Figure 35. Recommended Land Pattern Rev. B | Page 13 of 20 |
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