MP6003 datasheet(2/15 Pages) MPS

2 / 15 page

MP6003 – MONOLITHIC FLYBACK/SEPIC DC-DC CONVERTER

MP6003 Rev. 1.01

www.MonolithicPower.com

1/26/2014

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP6003DN

SOIC8E

MP6003

-40

°C to +85°C

* For Tape & Reel, add suffix –Z (eg. MP6003DN–Z).

For RoHS compliant packaging, add suffix –LF (eg. MP6003DN–LF–Z)

PACKAGE REFERENCE

GND

LINE

COMP

VIN

VCC

TOP VIEW

ABSOLUTE MAXIMUM RATINGS

(1)

VSW..............................................-0.5V to +180V

VIN ..............................................-0.3V to +120V

All Other Pins...............................-0.3V to +6.5V

Continuous Power Dissipation… (TA = +25°C)

(2)

……………………………………………......2.5W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature............... -65°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VCC ...........................4.5 V to 6V

Output Voltage VSW.....................-0.5V to +150V

Input Voltage VIN .........................+10V to +100V

Maximum Junction Temp. (TJ) ................+125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8E .................................. 50 ...... 10...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.

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