LP6283–00

Version 0.0

Jul.-2016

Email: marketing@lowpowersemi.com

www.lowpowersemi.com

Page 6 of 10

Preliminary Datasheet

LP6283

Absolute Maximum Ratings

Note 1



IN2, INVL SUPN, FSEL to GND -----------------------------------------------------------------------------

-0.3V to +16.5V



SUPP, GD_I, OPS, LDO_I to GND -------------------------------------------------------------------------

-0.3V to +20V



DRVP to CPGND ------------------------------------------------------------------------------------------------



DRVN to GND ----------------------------------------------------------------------------------------------------



OPO, OPP, OPN to OGND -----------------------------------------------------------------------------------



LDO_O to GND ---------------------------------------------------------------------------------------------------



FB1, FB2, FBP, FBN, GVOFF, DLY, LDO_FB, THR, EN to GND --------------------------------

−0.3V to 6.5V



OUT, REF, COMP, SS,XAO, VDET, CLIM to GND ----------------------------------------------------

−0.3V to 6.5V



PGND, OGND, CPGND to GND ----------------------------------------------------------------------------

±0.3V



BST to PGND ----------------------------------------------------------------------------------------------------

−0.3V to 20V



LX1 to PGND -----------------------------------------------------------------------------------------------------

−0.3V to 20V



LX2 to PGND -----------------------------------------------------------------------------------------------------

−0.3V to (IN2+0.3V)



VGHM, VGH, DRN to GND -----------------------------------------------------------------------------------

−0.3V to 40V



VGH to VGHM ----------------------------------------------------------------------------------------------------

−0.3V to 40V



VGH, VGHM to DRN --------------------------------------------------------------------------------------------

−0.3V to 40V



℃ to 150℃



Operation Ambient Temperature Range----------------------------------------------------------------

-40°C to +85°C



Storage Temperature Range ------------------------------------------------------------------------------ -65°C to +150°C



Maximum Soldering Temperature (at leads, 10sec) ------------------------------------------------- +260°C



Maximum Junction Temperature ------------------------------------------------------------------------- 150°C

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections

of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Thermal Information



Thermal Resistance

TQFN-48 7x7,

θJA ------------------------------------------------------------------------------------------- 35°C/W

TQFN-48 7x7,

θJC ---------------------------------------------------------------------------------------------- 6°C/W

ESD Susceptibility



HBM(Human Body Mode)

Note 2

----------------------------------------------------------------------- 2KV



MM(Machine Mode)

Note 3

------------------------------------------------------------------------------- 200V

Note 2.

The Human body model (HBM) is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The testing is done according

JEDEC.

Note 3.

Machine Model (MM) is a 200pF capacitor discharged through a 500nH inductor with no series resistor into each pin. The testing is

done according JEDEC.